• Contents
  • Research & Development
  • Events
  • Editorial
  • Subscription
  • Media
  • Newsletter
textile network
textile network
  • News
  • Technical Textiles
  • Fashion
  • Home Textiles
  • Business
  • Current issue
search.box
  • Spring 2021 go to content
  • Autumn 2020 go to content
  • Summer 2020 go to content
  • March/April 2020 go to content
  • January/February 2019 go to content
  • More Publications
    • November/December 2019
    • September/October 2019
    • July/August 2019
    • May/June 2019
    • March/April 2019
    • show all
  • Contents
    • News
    • Technical Textiles
    • Fashion
    • Home Textiles
    • Business
    • Current issue
  • Research & Development
  • Events
  • Editorial
  • Subscription
  • Media
  • Newsletter

20/07/2015

TITV Greiz: Sensory applications in micro-systems technology

Sensors are a basic requirement and the main initiator when textiles have to be equipped with intelligent functions. At the present this development is dominated by the adaption of conventional sensing elements (e.g. electronic circuits) thus textile typical characteristics of goods are affected and production costs rise up due to additional fabrication steps. Textile pre-products which are assembled with micro-parts represent a cost-efficient way to integrate microelectronic sensors into textiles.

Next image
Passivation of a multilayered woven circuit arrangement with a plastic membrane using tip-coating and deep-drawing, respectively Photos: TITV Greiz

Passivation of a multilayered woven circuit arrangement with a plastic membrane using tip-coating and deep-drawing, respectively Photos: TITV Greiz

 
Passivation of a multilayered woven circuit arrangement with a plastic membrane using tip-coating and deep-drawing, respectively Photos: TITV Greiz

Passivation of a multilayered woven circuit arrangement with a plastic membrane using tip-coating and deep-drawing, respectively Photos: TITV Greiz

 
Textile tape equipped with light emitting diodes and waterproof finishing

Textile tape equipped with light emitting diodes and waterproof finishing

 
Textile circuit arrangement with electronic components and typical solder connection displayed in detail

Textile circuit arrangement with electronic components and typical solder connection displayed in detail

 
Demonstration model of a fibre-optic textile-integrated sensor assembly

Demonstration model of a fibre-optic textile-integrated sensor assembly

 
Back to article
  • Most read
  • Latest

18/09/2020

London Fashion Week

Pantone Fashion Colour Trend Report Spring/Summer 2021

By  Iris Schlomski

08/05/2020

Deutschland näht

Corona: Textilproduzenten stellen auf Mund-Nasen-Masken um

By  Hans-Werner Oertel

17/02/2021

Diligence in the garment and footwear sector

The 2021 OECD Garment Forum

By  Iris Schlomski

22/02/2021

Digitization par excellence

Bodo Jagdberg: From F/S 2022 collections easy to sample online

By  Iris Schlomski

28/02/2016

Dupont Sorona: Fibre from renewable raw materials

By  Editorial staff

25/02/2021

A. Monforts Textilmaschinen

1st World Congress on Textile Coating: Montex Coat ticks all the right boxes for coating success

By  Iris Schlomski

25/02/2021

Combining technology and creativity

Marc Cain: Striding into the future with 3D design software

By  Iris Schlomski

25/02/2021

Mobility Turnaround, Part 1

Where can the journey go? An overview

By  Editorial staff

24/02/2021

Sustainability: Sustainable Nylon-6

Genomatica: Bio-nylon with Aquafil

By  Iris Schlomski

24/02/2021

PSI, PromoTex Expo and viscom

Reed Exhibitons: Trade shows have so much more to offer in 2021

By  Iris Schlomski

  • Meisenbach Verlag
  • Media
  • Data security
  • Imprint
  • Twitter
  • Facebook
  • RSS Feed
Meisenbach Logo